DF160R12W2H3FB11
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MPN DF160R12W2H3FB11Описание Fast and solder-less assembly is possible using our EasyPACK™ 2B 1200V chopper IGBT modules with the proven PressFIT technology and High Speed IGBT H3.Бренд InfineonCase/Package AG-EASY2B-2Lead-Free Status Lead FreeКоличество штифтов 25Operating Temperature (Max) 150 ℃
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- Case/Package: AG-EASY2B-2
- Lead-Free Status: Lead Free
- Количество штифтов: 25
- Operating Temperature (Max): 150 ℃
- Operating Temperature (Min): -40 ℃
- Упаковка: Tray
- Power Dissipation (Max): 190000 mW
- Product Lifecycle Status: Obsolete
- RoHS: RoHS Compliant
Fast and solder-less assembly is possible using our EasyPACK™ 2B 1200V chopper IGBT modules with the proven PressFIT technology and High Speed IGBT H3.
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